Our HYAMP® III Series of manual Ground Bond instruments verifies the integrity of your product’s ground circuitry in a convenient benchtop design. Choose from 4 different models with varying output current capabilities in compliance with international standards on the production line or in the lab. Choose to operate the HYAMP® III from our intuitive user interface or utilize the PLC I/O. Accurate 4-wire measurement and milliohm offset capability ensure your test results are accurate. Use the HYAMP® III stand-alone or interconnect with a Hypot® III or HypotULTRA® to form a complete safety compliance test system.